Multi layer rigid flex bonding board (HDI process); Applied to cameras on industrial control devices

Multi layer flexible board is composed of multiple single-sided or double-sided substrates and pure adhesive stacked and combined according to various processes. Each layer has graphic circuits and can achieve conductivity between layers, greatly improving design flexibility within a limited space size range. At the same time, it also has a certain degree of flexibility, making assembly convenient; At present, it is mainly applied in fields such as consumer electronics and high-frequency communication.